Chip cooling technology breakthrough, IBM

March 26th, 2007

“At the IEEE Semi-Therm Conference 2007, IBM researchers unveiled details of a new technique to significantly improve capabilities to cool computer chips. The technique, developed by a team of scientists at the IBM Zurich Research Laboratory in cooperation with Momentive Performance Materials, formerly GE Advanced Materials, overcomes a barrier in chip cooling by improving the application of the “glue” that binds chips to their cooling systems. The new technology could allow faster computer chips to be cooled more efficiently…” (Read full article here)

Entry Filed under: Computer & Technology